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Summit is committed to continuously reviewing and improving our operations in order to consistently provide customers with quality, reliability and on-time delivery that meets or exceeds their expectations. This is achieved by:
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Ensuring that the entire organization is focused on customer requirements |
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Ensuring that our manufacturing partners and suppliers exceed our quality standards |
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Establishing and reviewing key performance metrics and taking improvement action as needed |
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Ensure that New Product Qualifications meet customer, and industry standard, requirements and maintain that level with an ongoing reliability monitoring program |
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Summit Microelectronics seeks customer satisfaction by providing innovative high quality products and services, and by continually improving everything we do.
What does it mean? It means that Summit is
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Customer-focused. Everything we do is dedicated to improving our customers’ products and businesses. |
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Innovative. We develop new products that create opportunities for our customers and our company. |
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Quality-focused. We strive to get it right the first time, on time. If we don’t, we resolve the issues to the customer’s satisfaction as quickly as possible. |
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Dedicated to getting better at what we do through continuous process improvement.
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We strive to ensure that the quality product you expect from Summit Microelectronics is delivered on time and exceeds your high expectations. Despite our sophisticated systems and security, we are aware that counterfeit and grey market parts are becoming more frequently available to the market. Since counterfeit and grey market products are always purchased from unauthorized vendors we urge you to only procure Summit Microelectronics products from an authorized source: either directly from Summit Microelectronics or from a Summit Microelectronics authorized distributor.
By buying directly or from an authorized distributor you can be confident that:
The product has been produced, handled and stored in accordance with Summit Microelectronics quality standards.
Summit Microelectronics and its authorized distributors will jointly stand behind and address any warranty issues including important traceability capabilities.
You will receive after purchase services and technical support such as Applications Engineering and Failure Analysis.
Summit Microelectronics makes no warranties, expressed or implied, on any counterfeit or grey market products, including the right to a refund of the purchase price, replacement, or exchanges. We realize that most purchasers of counterfeit products are unaware they are doing so. You can only be confident of receiving legitimate Summit Microelectronics product by purchasing them from an authorized source.
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Summit uses a web based automated Product Change Notice process (PCN). Customers are encouraged to register to use the PCN system.
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Summit Failure Analysis Service
Summit's failure analysis service is part of the company's commitment to quality and customer service. Summit offers a failure analysis service to perform detailed analysis on suspected failing devices. The main goal of Summit's failure analysis service is to resolve problems thoroughly and quickly.
Using Summit 's Failure Analysis Services
To use Summit 's failure analysis services, customers should contact their local Summit sales office or Summit’s Customer Service department to request an RMA number.
Customers may also request a Failure Analysis Kit. The Failure Analysis Kit contains everything a customer needs to quickly and safely return devices to Summit for analysis. This includes proper packing materials, ship to instructions, and information on proper handling.
Failure Analysis Results
Upon receipt of the units Summit will assign a Failure Analysis case number and issue an acknowledgment. When necessary this acknowledgment will identify any additional information or details necessary to begin the analysis. The Preliminary Analysis Report is typically issued within three working days of receiving devices and required information at Summit. The Preliminary Analysis Report typically only contains physical examination results and gross functionality confirmation. Other non- Preliminary Analysis Report normally be sent to the requestor via email.
Summit will generate a Final Failure Analysis Report once testing and analysis is completed. This is typically within five to seven working days after the Preliminary Analysis Report is sent. On some occasions, testing and failure analysis may be more complex, thus requiring more time to determine a root cause. On these occasions, intermediate reports with status updates will be provided.
The Final Failure Analysis Report will normally be sent to the identified requestor via email.
Failure Analysis Considerations
Nearly half of all devices sent to Summit for failure analysis are good devices. Customers who send devices to Summit without first fully isolating the problem to the Summit IC can delay issue resolution. The Summit Field Applications and Quality Engineering groups can assist the customer in isolating the failure.
For devices in WLCSP type packages, removal of the device from the customer’s PCB and / or rework of solder balls is often necessary prior to electrical testing of the device and may delay the responses.
Devices with gross or mechanical damage may not be completely analyzable and root cause determination may not be possible. These types of failures are normally caused by Mechanical Overstress (MOS), an Electrical Overstress event (EOS) or electro-static discharge (ESD).
Out of warranty and discontinued products may not be covered by Summit’s Failure Analysis service. Please check with the factory in these cases.
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We believe that providing Engineering Sampling (ES) parts is beneficial by permitting our customers to perform an early assessment of a new product, configuration, or technology. Although no major anomalies in the testing protocols have been observed or are anticipated, ES Products are not yet fully qualified for production release. As such, the quality and reliability of the product has not yet been fully demonstrated as compliant to Summits requirements. Because of the nature of an unreleased product, we advise our customers to be aware of the following risks:
1) Specification Changes. Before a product is released, specifications may change due to many factors, including manufacturability, quality assurance, performance and functionality.
2) Supply Chain Changes. Prior to release, changes may be made to Manufacturing partner and Manufacturing location.
3) Pin-out Changes. Although very unlikely, changes may be made to pin assignments prior to product release.
4) Form Factor Changes. Prior to release, changes may be made to the package type(s) offered, package dimensions or aspect ratios.
5) Mask Changes. Prior to release, mask changes may be made to improve manufacturability, quality, performance or functionality.
6) Schedule Delays. Summit Microelectronics cannot yet guarantee delivery dates for unreleased products.
For these reasons, Summit Microelectronics cannot guarantee that any Engineering Samples will be identical in form, function, or specifications to the released product. Moreover, Summit Microelectronics makes no general commitment to notify customers in advance of changes to unreleased product. Customers are strongly encouraged to obtain from Summit Microelectronics the final released product datasheet, samples, and production schedule before committing to the ES product under their evaluation.
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